Jianfeng Luo (Selection)

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2 Jianfeng Luo, Subarna Sinha, Qing Su, Jamil Kawa, Charles Chiang: An IC manufacturing yield model considering intra-die variations. DAC 2006: 749-754

1 Jianfeng Luo, Qing Su, Charles Chiang, Jamil Kawa: A layout dependent full-chip copper electroplating topography model. ICCAD 2005: 133-140

Selection of 2 from 4 records - Jianfeng Luo has 9 coauthors

2		Jianfeng Luo, Subarna Sinha, Qing Su, Jamil Kawa, Charles Chiang: An IC manufacturing yield model considering intra-die variations. DAC 2006: 749-754
1		Jianfeng Luo, Qing Su, Charles Chiang, Jamil Kawa: A layout dependent full-chip copper electroplating topography model. ICCAD 2005: 133-140