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| 12 | C. Wei, Y. C. Liu, L. M. Yu, H. Chen, X. Wang: Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder. Microelectronics Reliability 50(8): 1142-1145 (2010) |
Selection of 1 from 12 records - Y. C. Liu has 21 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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