Johan Liu (Selection)

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4 C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu: Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectronics Reliability 47(2-3): 266-272 (2007)

Selection of 1 from 4 records - Johan Liu has 8 coauthors

Last update 2012-09-10 CET by the DBLP Team —

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