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| 16 | Cheng-Yi Liu, S.-W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai: Reliability of high-power LED packaging and assembly. Microelectronics Reliability 52(5): 761 (2012) |
Selection of 1 from 16 records - Cheng-Yi Liu has 36 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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