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| 107 | Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim: Block-level 3D IC design with through-silicon-via planning. ASP-DAC 2012: 335-340 |
Selection of 1 from 107 records - Sung Kyu Lim has 98 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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