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H. S. Lew (Selection)

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1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLJinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan: A testing method for assessing solder joint reliability of FCBGA packages. Microelectronics Reliability 44(5): 833-840 (2004)

Selection of 1 from 1 records - H. S. Lew has 4 coauthors

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