T. Lepistö (Selection)

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1 S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö: The effect of solder paste composition on the reliability of SnAgCu joints. Microelectronics Reliability 44(3): 485-494 (2004)

Selection of 1 from 1 records - T. Lepistö has 3 coauthors

Last update 2012-09-10 CET by the DBLP Team —

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