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| 1 | Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards: Wirebonding at higher ultrasonic frequencies: reliability and process implications. Microelectronics Reliability 43(1): 141-153 (2003) |
Selection of 1 from 1 records - S. J. Lehtonen has 5 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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