Tadahiro Kuroda (Selection)

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45 Tsutomu Takeya, Kazuhisa Sunaga, Koichi Yamaguchi, Hideyuki Sugita, Yoichi Yoshida, Masayuki Mizuno, Tadahiro Kuroda: A 6Gb/s receiver with discrete-time based channel filtering for wireline FDM communications. CICC 2010: 1-4

32 Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Masayuki Mizuno, Tadahiro Kuroda: An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing. J. Solid-State Circuits 45(10): 2057-2065 (2010)

22 Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno: Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. ISSCC 2009: 470-471

13 Kiichi Niitsu, Noriyuki Miura, Mari Inoue, Yoshihiro Nakagawa, Masamoto Tago, Masayuki Mizuno, Takayasu Sakurai, Tadahiro Kuroda: Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link. IEICE Transactions 90-C(4): 829-835 (2007)

Selection of 4 from 69 records - Tadahiro Kuroda has 119 coauthors

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45		Tsutomu Takeya, Kazuhisa Sunaga, Koichi Yamaguchi, Hideyuki Sugita, Yoichi Yoshida, Masayuki Mizuno, Tadahiro Kuroda: A 6Gb/s receiver with discrete-time based channel filtering for wireline FDM communications. CICC 2010: 1-4
32		Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Masayuki Mizuno, Tadahiro Kuroda: An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing. J. Solid-State Circuits 45(10): 2057-2065 (2010)
22		Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno: Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing. ISSCC 2009: 470-471
13		Kiichi Niitsu, Noriyuki Miura, Mari Inoue, Yoshihiro Nakagawa, Masamoto Tago, Masayuki Mizuno, Takayasu Sakurai, Tadahiro Kuroda: Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link. IEICE Transactions 90-C(4): 829-835 (2007)