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Wei-Chih Kuan (Selection)

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1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLWei-Chih Kuan, S. W. Liang, Chih Chen: Effect of bump size on current density and temperature distributions in flip-chip solder joints. Microelectronics Reliability 49(5): 544-550 (2009)

Selection of 1 from 1 records - Wei-Chih Kuan has 2 coauthors

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