Anne Jourdain (Selection)

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1 Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen: 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5

Selection of 1 from 5 records - Anne Jourdain has 47 coauthors

Last update 2012-09-10 CET by the DBLP Team —

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