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| 1 |       | Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006) |
Selection of 1 from 1 records - Hoh Huey Jiun has 3 coauthors
Copyright © 2010-01-06 by Michael Ley (ley@uni-trier.de)