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Hendrik Pieter Hochstenbach (Selection)

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3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLHendrik Pieter Hochstenbach, Willem D. van Driel, D. G. Yang, J. J. M. Zaal, E. Bagerman: Designing for reliability using a new Wafer Level Package structure. Microelectronics Reliability 50(4): 528-535 (2010)

Selection of 1 from 3 records - Hendrik Pieter Hochstenbach has 6 coauthors

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