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| 203 | Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong: Effective congestion reduction for IC package substrate routing. ACM Trans. Design Autom. Electr. Syst. 15(3): (2010) | |
| 183 | Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong: Diffusion-driven congestion reduction for substrate topological routing. ISPD 2009: 175-180 | |
| 175 | Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong: Substrate Topological Routing for High-Density Packages. IEEE Trans. on CAD of Integrated Circuits and Systems 28(2): 207-216 (2009) | |
| 168 | Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Tianpei Zhang, Robi Dutta, Xianlong Hong: Topological routing to maximize routability for package substrate. DAC 2008: 566-569 | |
| 148 | King Ho Tam, Yu Hu, Lei He, Tom Tong Jing, Xinyi Zhang: Dual-Vdd Buffer Insertion for Power Reduction. IEEE Trans. on CAD of Integrated Circuits and Systems 27(8): 1498-1502 (2008) |
Selection of 5 from 241 records - Lei He has 219 coauthors
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