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Pierric Gueguen (Selection)

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3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLH. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, L. Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet: Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectronics Reliability 52(2): 331-341 (2012)

Selection of 1 from 3 records - Pierric Gueguen has 28 coauthors

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