H. Grady (Selection)

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1 Paul Enquist, G. Fountain, C. Petteway, A. Hollingsworth, H. Grady: Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications. 3DIC 2009: 1-6

Selection of 1 from 1 records - H. Grady has 4 coauthors

Last update 2012-09-10 CET by the DBLP Team —

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