Jing Feng Gong (Selection)

Ask others: ACM DL/Guide - - CSB - MetaPress - Google - Bing - Yahoo

1

Esther Wai Ching Yau, Jing Feng Gong, Philip Chan: Al surface morphology effect on flip-chip solder bump shear strength. Microelectronics Reliability 44(2): 323-331 (2004)

Selection of 1 from 1 records - Jing Feng Gong has 2 coauthors