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X. J. Fan (Selection)

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4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLX. J. Fan, B. Varia, Q. Han: Design and optimization of thermo-mechanical reliability in wafer level packaging. Microelectronics Reliability 50(4): 536-546 (2010)
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLX. J. Fan, S. W. R. Lee, Q. Han: Experimental investigations and model study of moisture behaviors in polymeric materials. Microelectronics Reliability 49(8): 861-871 (2009)

Selection of 2 from 4 records - X. J. Fan has 12 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page