Darvin Edwards (Selection)

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Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen: Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability 41(5): 705-713 (2001)

Selection of 1 from 2 records - Darvin Edwards has 12 coauthors