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Zhong Chen (Selection)

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40Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLXuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen: Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectronics Reliability 49(2): 150-162 (2009)

Selection of 1 from 133 records - Zhong Chen has 155 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page