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P. Bowles (Selection)

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1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLJ. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear: High-lead flip chip bump cracking on the thin organic substrate in a module package. Microelectronics Reliability 52(2): 455-460 (2012)

Selection of 1 from 1 records - P. Bowles has 4 coauthors

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