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| 27 |       | Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Shan Zeng, Jinian Bian, Wenjian Yu, Hannah Honghua Yang, Vijay Pitchumani, Chung-Kuan Cheng: Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning. IEEE Trans. on CAD of Integrated Circuits and Systems 26(4): 645-658 (2007) |
| 18 | | Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Shan Zeng, Jinian Bian, Hannah Honghua Yang, Vijay Pitchumani, Chung-Kuan Cheng: Integrating dynamic thermal via planning with 3D floorplanning algorithm. ISPD 2006: 178-185 |
| 16 | | Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Jinian Bian, Hannah Honghua Yang, Vijay Pitchumani: Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration. ACM Trans. Design Autom. Electr. Syst. 11(2): 325-345 (2006) |
| 8 | | Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Yici Cai, Jinian Bian, Hannal Yang, Prashant Saxena, Vijay Pitchumani: A divide-and-conquer 2.5-D floorplanning algorithm based on statistical wirelength estimation. ISCAS (6) 2005: 6230-6233 |
Selection of 4 from 69 records - Jinian Bian has 65 coauthors
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