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Eric Beyne (Selection)

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22Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLGeert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal: Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. J. Solid-State Circuits 46(1): 293-307 (2011)
17Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLGeert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal: Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC 2010: 1-4
16Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLGeert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne: Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149
15Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLYann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne: Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4

Selection of 4 from 31 records - Eric Beyne has 123 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page