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A. Aubert (Selection)

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2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLA. Aubert, J. P. Rebrasse, L. Dantas de Morais, Nathalie Labat, Hélène Frémont: Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectronics Reliability 50(9-11): 1688-1691 (2010)
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLA. Aubert, L. Dantas de Morais, J. P. Rebrasse: Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. Microelectronics Reliability 48(8-9): 1144-1148 (2008)

Selection of 2 from 3 records - A. Aubert has 6 coauthors

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