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Xiao Fang Ang (Selection)

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2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLC. S. Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong: Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. Microelectronics Reliability 52(2): 321-324 (2012)

Selection of 1 from 2 records - Xiao Fang Ang has 8 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page