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@article{DBLP:journals/tvlsi/YuSHK08,
author = {Hao Yu and
Yiyu Shi and
Lei He and
Tanay Karnik},
title = {Thermal Via Allocation for 3-D ICs Considering Temporally
and Spatially Variant Thermal Power},
journal = {IEEE Trans. VLSI Syst.},
volume = {16},
number = {12},
year = {2008},
pages = {1609-1619},
ee = {http://dx.doi.org/10.1109/TVLSI.2008.2001297},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2009-01-31 by Michael Ley (ley@uni-trier.de)