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@article{DBLP:journals/tvlsi/WongML06,
author = {Eric Wong and
Jacob R. Minz and
Sung Kyu Lim},
title = {Multi-Objective Module Placement For 3-D System-On-Package},
journal = {IEEE Trans. VLSI Syst.},
volume = {14},
number = {5},
year = {2006},
pages = {553-557},
ee = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2006.876111},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2006-09-18 by Michael Ley (ley@uni-trier.de)