BibTeX record journals/tvlsi/LinCHSCL21a

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@article{DBLP:journals/tvlsi/LinCHSCL21a,
  author       = {Jai{-}Ming Lin and
                  Wei{-}Yi Chang and
                  Hao{-}Yuan Hsieh and
                  Ya{-}Ting Shyu and
                  Yeong{-}Jar Chang and
                  Juin{-}Ming Lu},
  title        = {Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules
                  in a Fixed-Outline 3-D {IC}},
  journal      = {{IEEE} Trans. Very Large Scale Integr. Syst.},
  volume       = {29},
  number       = {9},
  pages        = {1652--1664},
  year         = {2021},
  url          = {https://doi.org/10.1109/TVLSI.2021.3100343},
  doi          = {10.1109/TVLSI.2021.3100343},
  timestamp    = {Thu, 16 Sep 2021 18:02:31 +0200},
  biburl       = {https://dblp.org/rec/journals/tvlsi/LinCHSCL21a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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