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BibTeX record journals/tvlsi/LeeC09
@article{DBLP:journals/tvlsi/LeeC09, author = {Ren{-}Jie Lee and Hung{-}Ming Chen}, title = {Fast Flip-Chip Pin-Out Designation Respin for Package-Board Codesign}, journal = {{IEEE} Trans. Very Large Scale Integr. Syst.}, volume = {17}, number = {8}, pages = {1087--1098}, year = {2009}, url = {https://doi.org/10.1109/TVLSI.2009.2017795}, doi = {10.1109/TVLSI.2009.2017795}, timestamp = {Wed, 11 Mar 2020 18:18:28 +0100}, biburl = {https://dblp.org/rec/journals/tvlsi/LeeC09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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