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BibTeX record journals/tvlsi/ChiMGW14
@article{DBLP:journals/tvlsi/ChiMGW14, author = {Chun{-}Chuan Chi and Erik Jan Marinissen and Sandeep Kumar Goel and Cheng{-}Wen Wu}, title = {Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base}, journal = {{IEEE} Trans. Very Large Scale Integr. Syst.}, volume = {22}, number = {11}, pages = {2388--2401}, year = {2014}, url = {https://doi.org/10.1109/TVLSI.2013.2293192}, doi = {10.1109/TVLSI.2013.2293192}, timestamp = {Mon, 05 Feb 2024 20:25:48 +0100}, biburl = {https://dblp.org/rec/journals/tvlsi/ChiMGW14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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