Wafer-level package interconnect options.

J. Balachandran Steven Brebels G. Carchon M. Kuijk Walter De Raedt Bart Nauwelaers Eric Beyne Wafer-level package interconnect options. 654-659 2006 14 IEEE Trans. VLSI Syst. 6 http://doi.ieeecomputersociety.org/10.1109/TVLSI.2006.878229 db/journals/tvlsi/tvlsi14.html#BalachandranBCKRNB06