BibTeX record journals/tvlsi/AthikulwongseEL14

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@article{DBLP:journals/tvlsi/AthikulwongseEL14,
  author       = {Krit Athikulwongse and
                  Mongkol Ekpanyapong and
                  Sung Kyu Lim},
  title        = {Exploiting Die-to-Die Thermal Coupling in 3-D {IC} Placement},
  journal      = {{IEEE} Trans. Very Large Scale Integr. Syst.},
  volume       = {22},
  number       = {10},
  pages        = {2145--2155},
  year         = {2014},
  url          = {https://doi.org/10.1109/TVLSI.2013.2285593},
  doi          = {10.1109/TVLSI.2013.2285593},
  timestamp    = {Sun, 02 Oct 2022 15:52:19 +0200},
  biburl       = {https://dblp.org/rec/journals/tvlsi/AthikulwongseEL14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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