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@article{DBLP:journals/todaes/YuHH09,
author = {Hao Yu and
Joanna Ho and
Lei He},
title = {Allocating power ground vias in 3D ICs for simultaneous
power and thermal integrity},
journal = {ACM Trans. Design Autom. Electr. Syst.},
volume = {14},
number = {3},
year = {2009},
ee = {http://doi.acm.org/10.1145/1529255.1529263},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2009-06-23 by Michael Ley (ley@uni-trier.de)