Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.

Zhuoyuan Li Xianlong Hong Qiang Zhou Jinian Bian Hannah Honghua Yang Vijay Pitchumani Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration. 325-345 2006 11 ACM Trans. Design Autom. Electr. Syst. 2 http://doi.acm.org/10.1145/1142155.1142159 db/journals/todaes/todaes11.html#LiHZBYP06