BibTeX record journals/tie/ZhangDYZST19

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@article{DBLP:journals/tie/ZhangDYZST19,
  author       = {Jun Zhang and
                  Xiong Du and
                  Yaoyi Yu and
                  Shuai Zheng and
                  Pengju Sun and
                  Heng{-}Ming Tai},
  title        = {Thermal Parameter Monitoring of {IGBT} Module Using Junction Temperature
                  Cooling Curves},
  journal      = {{IEEE} Trans. Ind. Electron.},
  volume       = {66},
  number       = {10},
  pages        = {8148--8160},
  year         = {2019},
  url          = {https://doi.org/10.1109/TIE.2018.2883258},
  doi          = {10.1109/TIE.2018.2883258},
  timestamp    = {Fri, 22 May 2020 15:36:07 +0200},
  biburl       = {https://dblp.org/rec/journals/tie/ZhangDYZST19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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