BibTeX record journals/tie/QuWYBZ22

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@article{DBLP:journals/tie/QuWYBZ22,
  author       = {Zilian Qu and
                  Wensong Wang and
                  Zhengchun Yang and
                  Qiwen Bao and
                  Yuanjin Zheng},
  title        = {High-Precision Thickness Measurement of Cu Film on Si-Based Wafer
                  Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated
                  Circuit Techniques},
  journal      = {{IEEE} Trans. Ind. Electron.},
  volume       = {69},
  number       = {9},
  pages        = {9556--9565},
  year         = {2022},
  url          = {https://doi.org/10.1109/TIE.2021.3111570},
  doi          = {10.1109/TIE.2021.3111570},
  timestamp    = {Wed, 27 Apr 2022 20:10:38 +0200},
  biburl       = {https://dblp.org/rec/journals/tie/QuWYBZ22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}