Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method.

Wenjian Yu Mengsheng Zhang Zeyi Wang Efficient 3-D extraction of interconnect capacitance considering floating metal fills with boundary element method. 12-18 2006 25 IEEE Trans. on CAD of Integrated Circuits and Systems 1 http://dx.doi.org/10.1109/TCAD.2005.853690 db/journals/tcad/tcad25.html#YuZW06