ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.

Yonghong Yang Zhenyu (Peter) Gu Changyun Zhu Robert P. Dick Li Shang ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis. 86-99 2007 26 IEEE Trans. on CAD of Integrated Circuits and Systems 1 http://dx.doi.org/10.1109/TCAD.2006.882589 db/journals/tcad/tcad26.html#YangGZDS07