BibTeX record journals/tcad/WenCHC22

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@article{DBLP:journals/tcad/WenCHC22,
  author       = {Hsiang{-}Ting Wen and
                  Yu{-}Jie Cai and
                  Yang Hsu and
                  Yao{-}Wen Chang},
  title        = {Via-Based Redistribution Layer Routing for InFO Packages With Irregular
                  Pad Structures},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {41},
  number       = {12},
  pages        = {5554--5567},
  year         = {2022},
  url          = {https://doi.org/10.1109/TCAD.2022.3155069},
  doi          = {10.1109/TCAD.2022.3155069},
  timestamp    = {Mon, 28 Aug 2023 21:31:05 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/WenCHC22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}