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BibTeX record journals/tcad/WenCHC22
@article{DBLP:journals/tcad/WenCHC22, author = {Hsiang{-}Ting Wen and Yu{-}Jie Cai and Yang Hsu and Yao{-}Wen Chang}, title = {Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures}, journal = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.}, volume = {41}, number = {12}, pages = {5554--5567}, year = {2022}, url = {https://doi.org/10.1109/TCAD.2022.3155069}, doi = {10.1109/TCAD.2022.3155069}, timestamp = {Mon, 28 Aug 2023 21:31:05 +0200}, biburl = {https://dblp.org/rec/journals/tcad/WenCHC22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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