Dummy-feature placement for chemical-mechanical polishinguniformity in a shallow-trench isolation process.

Ruiqi Tian Xiaoping Tang Martin D. F. Wong Dummy-feature placement for chemical-mechanical polishinguniformity in a shallow-trench isolation process. 63-71 2002 21 IEEE Trans. on CAD of Integrated Circuits and Systems 1 http://doi.ieeecomputersociety.org/10.1109/43.974138 db/journals/tcad/tcad21.html#TianTW02