BibTeX record journals/tcad/SunDSCT18

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@article{DBLP:journals/tcad/SunDSCT18,
  author       = {Zeyu Sun and
                  Ertugrul Demircan and
                  Mehul D. Shroff and
                  Chase Cook and
                  Sheldon X.{-}D. Tan},
  title        = {Fast Electromigration Immortality Analysis for Multisegment Copper
                  Interconnect Wires},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {37},
  number       = {12},
  pages        = {3137--3150},
  year         = {2018},
  url          = {https://doi.org/10.1109/TCAD.2018.2801221},
  doi          = {10.1109/TCAD.2018.2801221},
  timestamp    = {Fri, 19 Feb 2021 15:10:10 +0100},
  biburl       = {https://dblp.org/rec/journals/tcad/SunDSCT18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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