@article{DBLP:journals/tcad/PelkaMM88,
author = {Joachim Pelka and
K. P. Muller and
Hermann Mader},
title = {Simulation of dry etch processes by COMPOSITE},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {7},
number = {2},
year = {1988},
pages = {154-159},
ee = {http://doi.ieeecomputersociety.org/10.1109/43.3144},
bibsource = {DBLP, http://dblp.uni-trier.de}
}