BibTeX record journals/tcad/OhCH12

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@article{DBLP:journals/tcad/OhCH12,
  author       = {Dongkeun Oh and
                  Charlie Chung{-}Ping Chen and
                  Yu Hen Hu},
  title        = {Efficient Thermal Simulation for 3-D {IC} With Thermal Through-Silicon
                  Vias},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {31},
  number       = {11},
  pages        = {1767--1771},
  year         = {2012},
  url          = {https://doi.org/10.1109/TCAD.2012.2196435},
  doi          = {10.1109/TCAD.2012.2196435},
  timestamp    = {Mon, 26 Oct 2020 09:00:44 +0100},
  biburl       = {https://dblp.org/rec/journals/tcad/OhCH12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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