BibTeX record journals/tcad/LiuSTCW14

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@article{DBLP:journals/tcad/LiuSTCW14,
  author       = {Zao Liu and
                  Sahana Swarup and
                  Sheldon X.{-}D. Tan and
                  Hai{-}Bao Chen and
                  Hai Wang},
  title        = {Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference
                  Based Thermal Analysis of 3-D Stacked ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {33},
  number       = {10},
  pages        = {1490--1502},
  year         = {2014},
  url          = {https://doi.org/10.1109/TCAD.2014.2334321},
  doi          = {10.1109/TCAD.2014.2334321},
  timestamp    = {Thu, 24 Sep 2020 11:28:05 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/LiuSTCW14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}