<?xml version="1.0"?>
<dblp>
<article key="journals/tcad/LiuCJHZDH09" mdate="2009-06-30">
<author>Shenghua Liu</author>
<author>Guoqiang Chen</author>
<author>Tom Tong Jing</author>
<author>Lei He</author>
<author>Tianpei Zhang</author>
<author>Robi Dutta</author>
<author>Xianlong Hong</author>
<title>Substrate Topological Routing for High-Density Packages.</title>
<pages>207-216</pages>
<year>2009</year>
<volume>28</volume>
<journal>IEEE Trans. on CAD of Integrated Circuits and Systems</journal>
<number>2</number>
<ee>http://dx.doi.org/10.1109/TCAD.2008.2009154</ee>
<url>db/journals/tcad/tcad28.html#LiuCJHZDH09</url>
</article>
</dblp>
