BibTeX record journals/tcad/LeeSYK23

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@article{DBLP:journals/tcad/LeeSYK23,
  author       = {Hayoung Lee and
                  Seung Ho Shin and
                  Younwoo Yoo and
                  Sungho Kang},
  title        = {{TRUST:} Through-Silicon via Repair Using Switch Matrix Topology},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {42},
  number       = {7},
  pages        = {2377--2390},
  year         = {2023},
  url          = {https://doi.org/10.1109/TCAD.2022.3220711},
  doi          = {10.1109/TCAD.2022.3220711},
  timestamp    = {Tue, 27 Feb 2024 16:41:39 +0100},
  biburl       = {https://dblp.org/rec/journals/tcad/LeeSYK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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