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@article{DBLP:journals/tcad/KuI08,
author = {Ja Chun Ku and
Yehea I. Ismail},
title = {Area Optimization for Leakage Reduction and Thermal Stability
in Nanometer-Scale Technologies},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {27},
number = {2},
year = {2008},
pages = {241-248},
ee = {http://dx.doi.org/10.1109/TCAD.2007.913393},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2008-04-08 by Michael Ley (ley@uni-trier.de)