BibTeX record journals/tcad/KimML14

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@article{DBLP:journals/tcad/KimML14,
  author       = {Daehyun Kim and
                  Saibal Mukhopadhyay and
                  Sung Kyu Lim},
  title        = {TSV-Aware Interconnect Distribution Models for Prediction of Delay
                  and Power Consumption of 3-D Stacked ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {33},
  number       = {9},
  pages        = {1384--1395},
  year         = {2014},
  url          = {https://doi.org/10.1109/TCAD.2014.2329472},
  doi          = {10.1109/TCAD.2014.2329472},
  timestamp    = {Sun, 02 Oct 2022 15:50:16 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/KimML14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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