Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation.

Lihong Feng Evgenii B. Rudnyi Jan G. Korvink Preserving the film coefficient as a parameter in the compact thermal model for fast electrothermal simulation. 1838-1847 2005 24 IEEE Trans. on CAD of Integrated Circuits and Systems 12 http://dx.doi.org/10.1109/TCAD.2005.852660 db/journals/tcad/tcad24.html#FengRK05