DBLP Record 'journals/tcad/FengRK05'

BibTeX

@article{DBLP:journals/tcad/FengRK05,
  author    = {Lihong Feng and
               Evgenii B. Rudnyi and
               Jan G. Korvink},
  title     = {Preserving the film coefficient as a parameter in the compact
               thermal model for fast electrothermal simulation},
  journal   = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume    = {24},
  number    = {12},
  year      = {2005},
  pages     = {1838-1847},
  ee        = {http://dx.doi.org/10.1109/TCAD.2005.852660},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}